1 / 4 www.asb.co.kr a u g us t 201 7 p lerow tm aln1850t2 internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following ga in blocks in the infrastructure equipment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed ma tching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 1700 2000 gain db 22 23 gain flatness db ? 1.5 ? 1.7 noise figure db 0.60 0.65 output ip3 (1) dbm 34 35 s11 / s22 (2) db - 18 / - 10 output p1db dbm 20 21 switching time (3) ? sec - supply current ma 100 120 supply voltage v 5 impedance ? 50 package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 5 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage from 0 v to v s . pin number function 2 rf in 5 rf out 6 vs other s ground ou t line drawing (unit: mm) note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tio ns. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the left side. (recommended footprint) aln1850t2 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area website: www.asb.co.kr e - mail: sales@asb.c o.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion 2 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 1850 mhz, z o.sys = 50 ohm feature s description s 21 = 24.5 db @ 1700 mhz = 21.5 db @ 2000 mhz nf of 0.6 db over frequen cy unconditionally stable single 5v supply high oip3 @ low current
2 / 4 www.asb.co.kr a u g us t 201 7 p lerow tm aln1850t2 internally matched lna module s - param e ters noise figure oip3 p1db 1700~2000 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 4 www.asb.co.kr a u g us t 201 7 p lerow tm aln1850t2 internally matched lna module 1. s - parameter 2. oip3, p1db & nf note: tested at room temperature. 1. s - parameter 2. oip3, p1db & nf note: tested at v s = 5 v . 1700 mhz 1850 mhz 2000 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) 4.50 v 25.58 - 21.25 - 18.85 24.20 2.77 - 21.19 - 19.52 22.81 - 21.52 - 14.90 4.75 v 25.81 - 21.67 - 18.22 24.40 2.81 - 21.15 - 19.21 23.00 - 21.32 - 14.80 5.00 v 26.00 - 21.10 - 17.95 24.58 2.84 - 21.09 - 18.03 23.16 - 21.02 - 14.78 5.25 v 2 6.11 - 22.33 - 17.93 24.68 2.86 - 21.16 - 18.89 23.25 - 20.93 - 14.71 5.50 v 26.18 - 22.67 - 18.06 24.74 2.87 - 21.08 - 18.96 23.31 - 20.08 - 14.70 1700 mhz 1850 mhz 2000 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) n f (db) oip3 (dbm) p1db (dbm) nf (db) 4.50 v 30.88 20.34 0.567 30.83 20.18 0.563 31.05 20.49 0.569 4.75 v 33.39 21.28 0.568 33.22 21.16 0.571 33.47 21.34 0.579 5.00 v 35.53 21.90 0.571 35.16 21.86 0.576 35.27 22.00 0.584 5.25 v 37.09 22.35 0.598 36.52 2 2.44 0.591 36.68 22.46 0.596 5.50 v 37.82 22.76 0.600 37.67 22.82 0.603 37.75 22.87 0.604 1700 mhz 1850 mhz 2000 mhz s21 (db) s11 (db) s22 (db) s21 (db) g/f (db) s11 (db) s22 (db) s21 (db) s11 (db) s22 (db) - 45 ? c 26.81 - 23.70 - 13.82 25.39 2.78 - 21.69 - 15.15 24.03 - 20.46 - 14.33 - 10 ? c 26.56 - 2303 - 15.04 25.15 2.74 - 21.62 - 16.07 23.82 - 20.29 - 14.53 25 ? c 26.23 - 22.82 - 16.40 24.81 2.77 - 21.46 - 17.02 23.46 - 20.97 - 14.85 60 ? c 26.01 - 22.62 - 17.61 24.60 2.74 - 21.2 7 - 17.33 23.27 - 19.90 - 14.61 85 ? c 25.81 - 22.27 - 18.86 24.40 2.75 - 20.72 - 17.65 23.06 - 19.69 - 14.51 1700 mhz 1850 mhz 2000 mhz oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) oip3 (dbm) p1db (dbm) nf (db) - 45 ? c 35.53 23.3 0 0.312 35.54 23.56 0.325 35.47 22.50 0.376 - 10 ? c 35.45 22.71 0.352 35.44 22.93 0.435 35.25 22.46 0.454 25 ? c 35.43 22.26 0.514 35.16 22.36 0.536 35.15 22.26 0.579 60 ? c 34.97 21.70 0.669 34.68 21.59 0.680 34.57 21.56 0.725 85 ? c 34.05 21.10 0.825 33. 64 20.81 0.831 33.61 20.91 0.895 rf performance with operating temperature rf performance with voltage change
4 / 4 www.asb.co.kr a u g us t 201 7 p lerow tm aln1850t2 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determine d by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical performance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the aln module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wan ts. the value of c1 & c2 is determined by considering the application fr e- quency. copyright ? 2009 - 2017 asb inc. all rights reserved. datasheet subject to change without notice. asb assumes no re- sponsibility for any errors which may appear in this datasheet. no part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of asb. application circuit recommended soldering reflow process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - aln out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs size 25x25mm (for aln - at, bt, t series C 10x10mm) evaluation board layout
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